| Country | Japan (JP) (ASIA) | | City | Tokyo | | Exhibit Date | 01 January 2005 | | Frequency | Annual | | Exhibit Location | Tokyo Big Sight, Tokyo, JAPAN | | Exhibits | Exhibition featuring all lines of Machinery, Parts and Materials for IC Packaging.
Products and Services
IC Packaging, outsourcing, assembly equipment, packaging, materials, components, inspection,testing and measuring equipment. Packaging equipment and other IC related packaging technology.
| | Website | http://www.reedexpo.co.jp/icp/ |
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